Our aim is to bring you a hearty smile and abundance of life.
We are a "group thinking of technology" looking ahead to the future, and always take on new research development. Technical employees, who make up about one third of all our employees, work in research and technology development.
I.S.T recognizes that it’s essential to integrate environmental, social, and economic structures of sustainable measures into our business and its future work structure.
Reshape common sense. We develop new materials that are world firsts, and contributing to the world. And furthermore to the universe. We hope that the materials we generate will be given life and utilized to lead to significant world improvement.
I.S.T's own technology has increased its need on a global scale, and we’ve expanded our activity locations. The network that connects research development, production, and sales at each location responds rapidly to the accelerating change of the times.
We are a group that is always thinking and constantly trying out new things. After each of us aggressively puts ideas out, we give a concrete shape to them, and manufacture things to be of advantage to companies and the world.
As a general sales agency of I.S.T Corporation, we sell various functional products, such as heat-resistant polyimid resin, office automation equipment parts, FRP parts, nonflammable function textile products, and clothing textile products.
Varnish is used to form a polyimide membrane with heat and voltage resistance, as well as having high-level mechanical strength. This material is used in a wide range of fields, such as electric wire coating materials for airplanes, as well as for medical tubes, due to its excellent features.
Polyimide varnish is used for heat-resistant and high strength compound materials, with many actual usages being achieved in airplanes. This material has the most thermal stability and adhesive properties among currently commercialized and mass-produced high-polymer materials.
High heat-resistant polyimide resin is based on I.S.T's proprietary techniques, which are used to form RTM (Resin Transfer Molding). Polyimide carbon FRP with very few voids can be made through injection forming.
A compact light-weighted polyimide foam with heat resistance and a low dielectric constant. The foam density can be controlled, and a wide range of foams from a 100 micrometer-thick thin film (sheet) to thick film (block) can be manufactured.
High heat-resistant polyimide composite with excellent thermal conductivity. This composite, which is lighter than metals, has the combined properties of a high glass-transition temperature derived from polyimide resin, and an extremely low CTE and high thermal conductivity derived from carbon fabric.
Binder for lithium-ion battery silicon anodes. This material has excellent adherence properties for copper foil and silicon alloy, and 97% of battery capacity can be retained after 400 cycles of charging and discharging.
Transparent polyimide film with a heat resistance of 300ºC and visible light transmission of 90% or more. We have also developed in-house equipment that is used to form film into a continuous roll, and have prepared the production system.
Heat-resistant and high strength seamless tube. This material is widely used in Japan and abroad for such applications as office automation equipment (copiers, printers), transfer/drive mechanisms of precision equipment, laminated belts in the high temperature range, and insulating sleeves.
Heat-resistant, high strength, and low hygroscopic polyimide fiber. This is a super fiber with a 3.0 GPa strength, and a continuous service temperature of 250ºC or more.
Here you can download PDFs of the Safety Data Sheets（SDS） for our products.
We develop new materials under our motto of developing things that are world firsts. We continue to utilize next-generation themes through joint research with universities and institutions in Japan and abroad, as well as our own development of independent equipment.
SKYBOND FOAM is a light weight foamed plastic cushioning material which has a maximum heat resistance of 330°C, therefore making it an ideal heat resistant insulating material for use in an environment of over 100°C.
SKYBOND FOAM has a great characteristic in comparison to other polyimide foams. During manufacturing, the expansion ratio can be finely controlled, ranging from soft, light and low density foam to hard and solid state foam.
In addition, componentization (compounding) is available by combining SKYBOND with other materials. As an example of this application, lightweight radar absorbers can be made by dispersing conductive fillers inside foams.
*SKYBOND is a registered trademark of I.S.T Corporation.
Polyimide is at the top of its class in terms of performance among engineering plastic materials.
Polyimide is a well-balanced noncombustible high strength material which has a higher level of chemical, radiation and cold temperature resistance, providing electrical insulation in addition to a heat resistance of 330°C. In addition to these qualities, polyimide foams have heat insulating and lightweight properties.
Lightweight radar absorbers
Compounding SKYBOND FOAM with conductive fillers, such as carbon, can result in the manufacturing of high heat-resistant and lightweight radar absorbers, which can be used to absorb radio waves in specific areas.
Sandwich panel core materials
Sandwich panels are made by putting foam between two sheets of FRP (Fiber Reinforced Plastics). For these foams, polyimide foams are most appropriate, due to their high strength, as well as their high resistance to heat, weather, and voltage.
Due to the unique characteristics of polyimide, SKYBOND FOAM exhibits an extremely low dielectric constant and low dielectric loss tangent, which indicate the degrees of radio wave energy loss as index specific to materials. This product can be appropriately installed in places subject to transmitted radio waves, due to its properties of high radio wave transmission, and lesser energy loss. Below is the graph of the dielectric constant of SKYBOND FOAM, and radio wave transmission property data to thickness.